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GMB-L3TGL_img1GMB-L3TGL_img1

GMB-L3TGL

  • Intel® 11th Generation Core™ i3/i5/i7 Processor (Tiger Lake-UP3 Platform)
  • Supported 2x DDR4-3200 SO-DIMM, up to 64GB
  • 2x RJ-45 LAN port by 2.5GdE + 1GbE by internal (pinheaded)
  • Equipped 1 x Full-sized Mini PCIe, 1 x M.2 Key M (2280) , and 1 x M.2 Key E (2230)
  • Supported triple-display, LVDS, HDMI, and DisplayPort (Internal Type C support DP only)

Data Sheet PDF

SKU: GMB-L3TGL Category: Tag: Brand:
Description
Specifications
Ordering Informations
Overview / Features

This product is a 3.5-Inch form factor industrial mainboard which based on Intel® Tiger Lake-UP3 Processor Core™ i3-1115G4E / i5-1145G7E/ i7-1185G7E with Windows 10 IoT Enterprise 2021 (4 languages) supported.The industrial-grade GMB-L3TGL210/310/410, with size of 146mm x 102mm, has high computing power, triple-display capability, and various expansion slots make it well-suited for factory automation, intelligent transportation, digital signage, self-service kiosks, and medical applications. The Product supports two 260-pin DDR4-3200 SO-DIMM socket for up to 64GB of memory. To meet customer various needs, it also equipped with one Full-sized Mini PCIe slot with SIM socket. In addition, M.2 M key with mSATA support, and M.2 E key for wireless LAN require, it utilizes Intel® Iris® Xe Graphics to provide and feature triple-display capability through HDMI, DisplayPort and LVDS interfaces which enable multi-display in a limited space. Moreover, it has one RS-232/422/485 port, two RS-232 ports, total 3 ethernet ports with Intel controllers, four USB3.2 ports, two USB2.0 ports, audio interface (Mic-in, Line-out), one 4-bit GPIO port, one HDMI, one DisplayPort, and one LVDS port. The product can operates in temperature range from 0°C to 60°C and has +12~24V DC power supply input

Usage Examples

Medical application

Factory automation

Self-service kiosks

Digital signage

  • Intel® 11th Generation Core™ i3/i5/i7 Processor (Tiger Lake-UP3 Platform)
    • The product is equipped with an Intel Tiger Lake UP3 platform core processor. This processor family is renowned for its advanced processing capabilities, including multiple cores and threads, as well as improved graphics performance.
  • Supported 2x DDR4-3200 SO-DIMM, up to 64GB
    • Supported two 260-pin DDR4-3200 SO-DIMM socket for up to 64GB of memory to meet customer various needs.
  • 2x RJ-45 LAN port by 2.5GdE + 1GbE by internal (pinheaded)
    • 2x 2.5GbE with RJ45 connector on rear I/O by Intel I225 controller, and 1x GbE on internal pin header by Intel i210 controller.
  • Equipped 1 x Full-sized Mini PCIe, 1 x M.2 Key M (2280) , and 1 x M.2 Key E (2230)
    • Storage options include M.2 key M & SATA interfaces, such as SSD or HDD storage, for local data storage and operating system installation, 1 x Full-sized Mini PCIe for LTE nano-SIM holder (PCIe+USB Signal), 1 x M.2 Key M (2280) for storage (PCIe+SATA Signal), and 1 x M.2 Key E (2230) for wireless LAN (PCIe+USB Signal).
  • Supported triple-display, LVDS, HDMI, and DisplayPort (Internal Type C support DP only)
    • Supported triple display:- LVDS: Dual channel 18/24 bits (up to 1920 x 1200 @ 60Hz)- 1 x HDMI (up to 4096 x 2160 @ 30/24Hz)- 1 x Display Port (up to 4096 x 2304 @ 60Hz), and Internal Type C display: up to 4K (support DP only).

Specifications

Specifications
Form Factor
Type 3.5-inch
Software Support
Supported OS Windows 10 IoT Enterprise 2021 LTSC 64-bit
Core System
CPU Generation (Development code) 11th Gen. (Tiger Lake UP3)
Processor Core i7-1185G7E; Core i5-1145G7E; Core i3-1115G4E
CPU socket
Memory up to 64GB
RAS Hardware monitor (Fan speed / Temperature / Voltage); Watchdog timer
GPU
AI Performance
Security TCG TPM 2.0
Interface
Video 1x DisplayPort; 1x HDMI; 1x LVDS
LAN 2x 2500BASE-T
Wireless
Audio
I/O 4x USB3.2 Gen2
Memory card
Internal Interface
Video 1x USB 3.1 Gen1 (USB3.0) Type-C [DP Alt Mode]
LAN
Audio 1x Line out; 1x Mic-in
I/O 2x USB2.0; 2x RS-232C; 1x RS-232C/422A/485
Power connector
Expansion Slot
Expansion bus 1x M.2 Key E (2230); 1x M.2 Key M (2280); 1x Mini PCI Express
Drive bay
Power
Input voltage 12 to 24VDC
Environment
Operating temperature 0 to 60°C (32 to 140°F) w/ 0.7m/s airflow
Storage temperature -10 to 70°C (14 to 158°F)
Standards & Certifications CE; FCC Class A

Ordering Informations

Ordering Information
Model Description Certification
GMB-L3TGL410-0LH 3.5-inch SBC, Intel Tiger Lake-UP3 Core i7-1185G7E Processor, DDR4 SDRAM, with heat spreader
  • CE marking
  • FCC compliant
GMB-L3TGL410-0LN 3.5-inch SBC, Intel Tiger Lake-UP3 Core i7-1185G7E Processor, DDR4 SDRAM
  • CE marking
  • FCC compliant
GMB-L3TGL310-0LH 3.5-inch SBC, Intel Tiger Lake-UP3 Core i5-1145G7E Processor, DDR4 SDRAM, with heat spreader
  • CE marking
  • FCC compliant
GMB-L3TGL310-0LN 3.5-inch SBC, Intel Tiger Lake-UP3 Core i5-1145G7E Processor, DDR4 SDRAM
  • CE marking
  • FCC compliant
GMB-L3TGL210-0LH 3.5-inch SBC, Intel Tiger Lake-UP3 Core i3-1115G4E Processor, DDR4 SDRAM, with heat spreader
  • CE marking
  • FCC compliant
GMB-L3TGL210-0LN 3.5-inch SBC, Intel Tiger Lake-UP3 Core i3-1115G4E Processor, DDR4 SDRAM
  • CE marking
  • FCC compliant
Option Accessory
Cables
  • COM Port Cable
  • GPIO Cable
  • Audio Cable
  • SATA Cable
  • Mainboard DC IN Cable
  • SATA Power Cable